SynchroLux provides an extensive range of foundry solutions for wafer processing and semiconductor chip design.
SynchroLux is the only foundry in the world ready to provide rapid turnaround on single wafers.
Our core technologies are:
- MEMS
- 65-nm / 90-nm / 180-nm CMOS …and beyond
(PDK support available) - GaN/SiC-based Power Electronics
Our team of PhD scientists provide effective circuit design and optimized wafer processing solutions enabled by state-of-the-art equipment lines.
We welcome early-stage prototypes, and low-to-medium run production projects.
Our unique strengths are Flexibility, Customization, Cost-Effectiveness and Fast Turnaround Times.
SynchroLux Provides Streamlined Four-step Semiconductor Manufacturing
Wafer Processing Services
- Processing services are available on full/partial wafers
- SynchroLux supports 4″, 5″, 6″, 8″, and 12″ wafer sizes
- More options for processing than what is listed below are available.
- For further details, please contact us. We look forward to learning how we can help you!
FEOL Process
Wafer Preparation & Cleaning
- Pre-diffusion Cleaning
- Surface Activation
- Solvent Cleaning
- RCA Cleaning
- Wet Chemical Cleaning
Thermal Treatment
- Diffusion
- Annealing
- Sintering
- RTP
EUV-DUV Lithography
- Mask-based Lithography
- Non-mask-based Lithography
Thin-Film Deposition
- PVD
- CVD
- DC/RF Sputtering
Dry Etching
- RIE
- DRIE
- Plasma Etching
- lon Beam Etching
Wet Etching
- Chemical Etching
- KOH Etching
- HF Etching
- HNO3 Etching
- and much more!
Oxidation
- Thermal Oxidation
- Wet Oxidation
- Dry Oxidation
- PECVD
Doping
- lon Implantation
- Diffusion
- NTD
- and much more!
BEOL Process
Metal Interconnect Deposition
- CVD
- PVD
Interconnect Formation
- Aluminum, Copper, Polysilicon
- Low-k Dielectrics
- Barrier Materials
- Dual Damascene Process
Metallization & Dielectric Layers
- Cu, Al, Au, W, TiN
- SiO2, Si3N4, etc.
- Polymide
- High-k Dielectrics
Post-BEOL Process
- CMP
- Grinding
- Wafer Dicing
- IC Packaging
- Wafer-to-Wafer Bonding
- Die-to-Wafer Bonding
- Wire Bonding
- Metrology and Wafer Testing
- and much more!